Matched by chemical composition and mechanical properties, not a formal equivalence claim. Always verify against the applicable standard before substitution.
Chemical Composition (%)
C
Si
Mn
P
S
Cr
Mo
Ni
N
Cu
<=0.020
<=0.75
<=2.00
<=0.035
<=0.015
19.0-22.0
4.0-5.0
23.5-26.0
<=0.15
1.20-2.00
Mechanical Properties
Tensile Strength
530-730 MPa
Yield Strength
>=220 MPa
Elongation
>=35%
Condition
Solution annealed, conditions 1C, 1E, 1D, 1X, 1G and 2D, thickness or diameter up to 160 mm; Yield Strength is Rp0.2, Elongation is A (longitudinal)
More data from IS 6603:2024
From the standard
Mechanical properties by thickness or diameter2 size ranges
Thickness or diameter (mm)
Rp0.2 min (MPa)
Rp1.0 min (MPa)
Rm (MPa)
A min, longitudinal (%)
A min, transverse (%)
KV2 min, longitudinal (J)
KV2 min, transverse (J)
up to 160
220
260
530 to 730
35
-
100
-
over 160 to 250
220
260
530 to 730
-
30
-
60
Solution annealed, conditions 1C, 1E, 1D, 1X, 1G and 2D; elongation and proof strength are not valid for rod.
Source: IS 6603:2024, Table 5
Bright bars, solution annealed6 rows
Thickness or diameter (mm)
Rp0.2 min (MPa)
Rm (MPa)
A5 min, longitudinal (%)
A5 min, transverse (%)
KV2 min, longitudinal (J)
KV2 min, transverse (J)
up to 10
400
600 to 930
20
-
-
-
over 10 to 16
400
600 to 930
20
-
-
-
over 16 to 40
230
530 to 880
25
-
100
-
over 40 to 63
230
530 to 880
25
-
100
-
over 63 to 160
230
530 to 730
35
-
100
-
over 160 to 250
230
530 to 730
-
30
-
60
Bright bars, conditions 2H, 2B, 2G or 2P; A5 valid for 5 mm and above.
Source: IS 6603:2024, Table 15
Proof strength at elevated temperature10 temperatures
Temperature (deg C)
Rp0.2 min (MPa)
Rp1.0 min (MPa)
100
205
235
150
190
220
200
175
205
250
160
190
300
145
175
350
135
165
400
125
155
450
115
145
500
110
140
550
105
135
Minimum values, solution annealed (+AT); for guidance only.
Source: IS 6603:2024, Table 10
Hot forming and solution annealingguideline temperatures
Hot forming temperature
1200 to 900 deg C
Cooling after hot forming
air
Heat treatment symbol
+AT
Solution annealing temperature
1050 to 1150 deg C
Cooling after solution annealing
water, air (rapid cooling)
Informative guideline (Annex A).
Source: IS 6603:2024, Table 20
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