Matched by chemical composition and mechanical properties, not a formal equivalence claim. Always verify against the applicable standard before substitution.
Chemical Composition (%)
C
Si
Mn
P
S
Cr
Ni
Mo
Cu
<=0.20
0.10-0.35
0.50-1.30
<=0.03
<=0.03
<=0.25
<=0.30
<=0.10
<=0.30
Mechanical Properties
Tensile Strength
410-520 MPa
Yield Strength
>=225 MPa (0.2 % proof stress)
Elongation
>=24%
Condition
Plate, quadrangular seamless pipe, N, thickness over 3 to 16 (first row of Table 3)
More data from IS 1570 (Part 7):1992
From the standard
Mechanical properties at room temperature5 rows
Product
Heat treatment
Thickness (mm)
Hardness (RB)
Rp0.2 min (MPa)
Rm min (MPa)
Rm max (MPa)
Elongation min (%)
KV (J)
Bend test D max
Plate, quadrangular seamless pipe
N
over 3 to 16
-
225
410
520
24
-
2a
Plate, quadrangular seamless pipe
N
over 16 to 40
-
215
410
520
24
-
2a
Plate, quadrangular seamless pipe
N
over 40 to 63
-
205
410
520
23
-
2a
Plate, quadrangular seamless pipe
N
over 63 to 100
-
200
410
520
22
-
2a
Plate, quadrangular seamless pipe
N
over 100 to 150
-
195
410
520
22
-
2a
Rm and elongation printed once for a group of thickness rows are repeated on each row; Rp0.2 'Note 8' is printed as in the standard; in case of dispute the tensile strength value is deciding.
Source: IS 1570 (Part 7):1992, Table 3
0.2 % proof stress at elevated temperature (guidance only)Rp0.2 min in MPa
Product, heat treatment, thickness
150 deg C
200 deg C
250 deg C
300 deg C
350 deg C
400 deg C
Plate, N, 3 to 16 mm
200
195
174
145
137
133
Plate, N, over 16 to 40 mm
192
185
165
145
137
133
Plate, N, over 40 to 63 mm
182
175
162
145
137
133
Plate, N, over 63 to 100 mm
170
166
157
145
137
133
For guidance only.
Source: IS 1570 (Part 7):1992, Table 4
Heat treatment4 entries
Normalising temperature
890 to 920 deg C
Normalising time
thickness of plate but not less than 20 min
Normalising cooling
in quiet air
Stress relief or tempering after bending or welding
600 to 650 deg C, thickness of plate but not less than 30 min
Indications are for guidance only except where test samples are reference heat treated; stress relief temperature should be at least 30 deg C below the tempering temperature.
Source: IS 1570 (Part 7):1992, Table 5
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